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XAZU2EG-1SFVA625I

XAZU2EG-1SFVA625I

XAZU2EG-1SFVA625I

Xilinx Inc.

625 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 128 I/O 0.85V

SOT-23

XAZU2EG-1SFVA625I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Package / Case 625-BFBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 625
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.85V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B625
Number of I/O 128
Speed 500MHz, 1.2GHz
RAM Size 1.2MB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, I2C, SPI, UART/USART, USB
Architecture MPU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Length 21mm
Height Seated (Max) 3.43mm
Width 21mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $347.10000 $347.1
XAZU2EG-1SFVA625I Product Details

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


A core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 625-BFBGA, FCBGA.With 1.2MB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MPU, FPGA architecture for its internal architecture.Zynq® UltraScale+™ MPSoC EG is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.This SoC security combines Zynq®UltraScale+™ FPGA, 103K+ Logic Cells, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.128 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 0.85V.In total, there are 625 terminations, so system on a chip is really aided by this.MICROPROCESSOR CIRCUIT is its uPs/uCs/peripheral IC and is used in all of its peripheral SoC meanings.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


1.2MB RAM.
Built on MPU, FPGA.
MICROPROCESSOR CIRCUIT


There are a lot of Xilinx Inc.


XAZU2EG-1SFVA625I System On Chip (SoC) applications.


  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
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