484 Terminations -40°C~125°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 128 I/O 0.85V
SOT-23
XAZU3EG-1SBVA484Q Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
6 Weeks
Package / Case
484-BFBGA, FCBGA
Surface Mount
YES
Operating Temperature
-40°C~125°C TJ
Packaging
Tray
Series
Zynq® UltraScale+™ MPSoC EG
Part Status
Active
Number of Terminations
484
HTS Code
8542.31.00.01
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
0.85V
Terminal Pitch
0.8mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
S-PBGA-B484
Number of I/O
128
Speed
500MHz, 1.2GHz
RAM Size
1.8MB
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Core Processor
Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™
Peripherals
DMA, WDT
Connectivity
CANbus, I2C, SPI, UART/USART, USB
Architecture
MPU, FPGA
Primary Attributes
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Length
19mm
Height Seated (Max)
2.61mm
Width
19mm
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$976.62000
$976.62
500
$966.8538
$483426.9
1000
$957.0876
$957087.6
1500
$947.3214
$1420982.1
2000
$937.5552
$1875110.4
2500
$927.789
$2319472.5
XAZU3EG-1SBVA484Q Product Details
This SoC is built on Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™ core processor(s).
A Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™ core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 484-BFBGA, FCBGA package.With 1.8MB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MPU, FPGA technique.Featured system on chip SoCs of the Zynq® UltraScale+™ MPSoC EG series.The average operating temps for this SoC meaning should be -40°C~125°C TJ.One important thing to mark down is that this SoC meaning combines Zynq®UltraScale+™ FPGA, 154K+ Logic Cells.Housed in the state-of-art Tray package.128 I/Os in total are included in this SoC part.It is advised to utilize a 0.85V power supply.There are 484 terminations in total and that really benefits system on a chip.It uses MICROPROCESSOR CIRCUIT as a uPs/uCs/Peripheral SoC.
Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™ processor.
1.8MB RAM. Built on MPU, FPGA. MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XAZU3EG-1SBVA484Q System On Chip (SoC) applications.