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XC1701LPDG8C

XC1701LPDG8C

XC1701LPDG8C

Xilinx Inc.

Through Hole 1Mb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC1701L

SOT-23

XC1701LPDG8C Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Surface Mount NO
Number of Pins 8
Operating Temperature 0°C~70°C
Packaging Tube
Published 2004
JESD-609 Code e3
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
Terminal Finish Matte Tin (Sn)
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 250
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 2.54mm
[email protected] Reflow Temperature-Max (s) 30
Base Part Number XC1701L
Pin Count 8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 1Mb
Operating Mode SYNCHRONOUS
Clock Frequency 15MHz
Supply Current-Max 0.01mA
Organization 1MX1
Output Characteristics 3-STATE
Memory Width 1
Standby Current-Max 0.00005A
Parallel/Serial SERIAL
I/O Type COMMON
Memory IC Type CONFIGURATION MEMORY
Height Seated (Max) 4.5974mm
Length 9.3599mm
Width 7.62mm
RoHS Status RoHS Compliant
XC1701LPDG8C Product Details

XC1701LPDG8C Overview


The package uses a neat 8-DIP (0.300, 7.62mm) interface.Packaging outside of Tube.As a qualified employee, I can operate within 0°C~70°C.Through OTP, it is programmable.A voltage of 3V~3.6V is applied to it.There is a memory device mounted in Through Hole position for this device.Data storage is limited to a size of 1Mb bytes.Search "XC1701L" for related parts.The supply voltage of the device must be 3.3V in order to operate correctly.FPGA is possible to connect different functions on the 8 axis at different terminations.This memory device can be used with a maximum voltage of 3.6V.FPGA is essential that a minimum voltage of 3V be supplied to the device in order for FPGA to function.Using the CONFIGURATION MEMORY memory chip, we can store data.FPGA is recommended that the reflow soldering temperature be maintained at no more than 250 during the process.The 8 pins are on the board.Through SERIAL-processing, data is transmitted from this memory to the CPU.The memory chip is allowed to operate at a voltage that is no greater than 0.01mA.Parts include 8 pins.I would like to mention that this is a memory IC that will be able to work at a 15MHz frequency, so I will mention that.The I/O configuration of the memory is COMMON.A power supply that is rated at 3.3V is recommended for use with this product.Thus, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is included to better serve customers.

XC1701LPDG8C Features


Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC1701LPDG8C Applications


There are a lot of Xilinx Inc. XC1701LPDG8C applications of configuration proms for FPGAs.

  • data buffer
  • telecommunications
  • hard disk drive (HDD)
  • personal digital assistants
  • Cache memory
  • personal computers
  • supercomputers
  • embedded logic
  • mainframes
  • servers

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