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XC17512LSO20I

XC17512LSO20I

XC17512LSO20I

Xilinx Inc.

Surface Mount Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC17512L

SOT-23

XC17512LSO20I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 20-SOIC (0.295, 7.50mm Width)
Surface Mount YES
Number of Pins 20
Operating Temperature -40°C~85°C
Packaging Tube
Published 2000
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 20
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn85Pb15)
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
HTS Code 8542.39.00.01
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 1.27mm
[email protected] Reflow Temperature-Max (s) 30
Base Part Number XC17512L
Pin Count 20
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Clock Frequency 15MHz
Supply Current-Max 0.005mA
Organization 512KX1
Output Characteristics 3-STATE
Memory Width 1
Density 512 kb
Standby Current-Max 0.00005A
Parallel/Serial SERIAL
I/O Type COMMON
Memory IC Type CONFIGURATION MEMORY
Height Seated (Max) 2.6416mm
Length 12.827mm
Width 7.5184mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
XC17512LSO20I Product Details

XC17512LSO20I Overview


An interesting 20-SOIC (0.295, 7.50mm Width) package is used for this.External packaging for the Tube series.A qualified individual who has the ability to operate within -40°C~85°C.The OTP programming language can be used to program it.An electric current of 3V~3.6V is applied to it.The memory device is mounted in Surface Mount.Try searching "XC17512L" for more parts.In order for it to function, it requires a voltage supply of 3.3V.With different functions, 20 terminations can be used.Using this memory device with a maximum voltage of 3.6V is possible.3V must be the minimum voltage supplied to the device.The memory chip in question is a CONFIGURATION MEMORY memory chip.If you're reflow soldering, you shouldn't go above 225.Pins on it are 20-shaped.As a result of the SERIAL process, data is transmitted from this memory.The memory chip operates at a voltage of no more than 0.005mA.With the part are included 20 pins.Using a 15MHz frequency, this memory IC can work at high speeds.There is a COMMON configuration for the memory's I/O.To run the part safely and stably in a circuit, 3.3V recommends users apply 3.3V on the part.Therefore, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is included in order to better meet customer needs.

XC17512LSO20I Features


Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17512LSO20I Applications


There are a lot of Xilinx Inc. XC17512LSO20I applications of configuration proms for FPGAs.

  • nonvolatile BIOS memory
  • DVD disk buffer
  • Cache memory
  • eSRAM
  • embedded logic
  • cell phones
  • printers
  • workstations,
  • personal digital assistants
  • supercomputers

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