XC3S400-5FT256C Overview

Fpga chips is supplied in the 256-LBGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. There are 173 I/Os for better data transfer. There are 8064 logic elements/cells to form a fundamental building block. 1.2V volts power it. FPGA parts like this belong to the Field Programmable Gate Arrays family. The Surface Mount-slot on the development board allows you to attach the FPGA module. The supply voltage of the device is 1.14V~1.26V , at which it runs. There are many types of FPGAs in the Spartan?-3 series, this is one of them. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. There are 173 outputs incorporated in this device. As a space-saving measure, this FPGA model is contained within Bulk. In total, the terminations of this piece are 256. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 294912 bFpga chipss. This FPGA module has a RAM si36kBe of 36kB that is sufficient to make sure that the program is able to run normally. In this case, 256 pins are used in the design. The FPGA is built as an array of 896 latches or CLBs. Designers can fully utilize its flexibility with 1.2V supply voltage. A basic building block for this type of building block consists of 400000 gates. This device has a pin count of 256 in fpga semiconductor. A CLB is a basic module that determines the architecture of a system.

XC3S400-5FT256C Features

173 I/Os
Up to 294912 RAM bits
256 LABs/CLBs

XC3S400-5FT256C Applications

There are a lot of Xilinx Inc. XC3S400-5FT256C FPGAs applications.

• Automotive
• Scientific Instruments
• Digital signal processing
• Consumer Electronics
• Defense Applications
• Software-defined radio
• Video & Image Processing
• Solar Energy
• OpenCL
• Aerospace and Defense