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XC3S5000-4FGG676C

XC3S5000-4FGG676C

XC3S5000-4FGG676C

Xilinx Inc.

1.2V V 2.6mm mm FPGAs Spartan?-3 Series 676-BGA 1mm mm 676

SOT-23

XC3S5000-4FGG676C Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 676-BGA
Number of Pins 676
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series Spartan®-3
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676
ECCN Code 3A991.D
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.2V
Terminal Pitch 1mm
[email protected] Reflow Temperature-Max (s) 30
Base Part Number XC3S5000
Pin Count 676
Number of Outputs 489
Qualification Status Not Qualified
Operating Supply Voltage 1.2V
Power Supplies 1.21.2/3.32.5V
Number of I/O 489
RAM Size 234kB
Clock Frequency 630MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 74880
Total RAM Bits 1916928
Number of Gates 5000000
Number of LABs/CLBs 8320
Speed Grade 4
Combinatorial Delay of a CLB-Max 0.61 ns
Height Seated (Max) 2.6mm
Length 27mm
Width 27mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
40 $127.00050 $5080.02
XC3S5000-4FGG676C Product Details

XC3S5000-4FGG676C Overview


The package that contains this software is called 676-BGA. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 489 I/Os allow data to be transferred in a more coherent manner. A fundamental building block consists of 74880 logic elements/cells. In order to operate fpga chips, a voltage supply of 1.2V volts is required. Part of the Field Programmable Gate Arrays family, this FPGA part is a programmable gate array. Surface Mount-connectors can be used to attach this FPGA module to the development board. This device is powered by a 1.14V~1.26V battery. It is a type of FPGA belonging to the Spartan?-3 seies. As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. This device is equipped with 489 separate outputs, which makes it a very versatile device. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, it has a total of 676 terminations. There are 1916928 RAM bits that are available with this device. In order to find related parts, use the part number XC3S5000 as a base. For the program to work properly, the RAM si234kBe of this FPGA module must reach 234kB GB in order to ensure normal operation. There are 676 pins on this device. A total of 8320 LABs/CLBs are included in this FPGA. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. Its flexibility can be fully utilized when operating with a 1.2V supply voltage. Fpga electronics operates from a 1.21.2/3.32.5V power supply. Its basic building block contains 5000000 gates. With a total of 676 pins, it is equipped with a high level of security. Most of the time, it uses a crystal oscillating at 630MHz to generate the signal.

XC3S5000-4FGG676C Features


489 I/Os
Up to 1916928 RAM bits
676 LABs/CLBs

XC3S5000-4FGG676C Applications


There are a lot of Xilinx Inc. XC3S5000-4FGG676C FPGAs applications.

  • Enterprise networking
  • Automotive driver's assistance
  • ASIC prototyping
  • Military DSP
  • Data Mining
  • Data center hardware accelerators
  • Aircraft navigation
  • Automotive
  • Voice recognition
  • Data Center

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