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XC7K325T-3FFG676E

XC7K325T-3FFG676E

XC7K325T-3FFG676E

Xilinx Inc.

3.37mm mm 1GB B FPGAs Kintex?-7 Series 676-BBGA, FCBGA 1mm mm 676

SOT-23

XC7K325T-3FFG676E Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 676-BBGA, FCBGA
Surface MountYES
Operating Temperature0°C~100°C TJ
PackagingTray
Published 2010
Series Kintex®-7
JESD-609 Code e1
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 676
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 0.97V~1.03V
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch1mm
Reach Compliance Code not_compliant
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number XC7K325T
Pin Count676
JESD-30 Code S-PBGA-B676
Number of Outputs 400
Qualification StatusNot Qualified
Power Supplies11.83.3V
Memory Size1GB
Number of I/O 400
RAM Size 2MB
Memory TypeDDR3
Clock Frequency 1412MHz
Number of Inputs 400
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 326080
Total RAM Bits 16404480
Number of LABs/CLBs 25475
Speed Grade -3
Number of Registers 407600
Combinatorial Delay of a CLB-Max 0.58 ns
Height Seated (Max) 3.37mm
Length 27mm
Width 27mm
RoHS StatusROHS3 Compliant
In-Stock:3206 items

Pricing & Ordering

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XC7K325T-3FFG676E Product Details

XC7K325T-3FFG676E Overview


In the package 676-BBGA, FCBGA, this product is provided. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. 400 I/Os are available for transferring data more efficiently. Logic elements/cells form the fundamental building block of a computer. In order to operate fpga chips, a voltage supply of 1V volts is required. A Field Programmable Gate Arrays-series FPGA part. With a Surface Mount connector, this FPGA module can be attached to the development board. This device is powered by a 0.97V~1.03V battery. It is a type of FPGA belonging to the Kintex?-7 seies. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~100°C TJ at all times. In this device, there are 400 outputs that can be used. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. Fpga chips is designed wFpga chipsh 676 terminations. The RAM bits that this device offer is 16404480. Related parts can be found by using its base part number XC7K325T. There is a maximum RAM si2MBe of 2MB on this FPGA module, which is necessary to ensure the normal operation of the program. The FPGA is built as an array of 25475 latches or CLBs. This is a battery operated device that operates on 11.83.3V. Fpga semiconductor is equipped wfpga semiconductorh 676 pin count. Most of the time, it uses a crystal oscillating at 1412MHz to generate the signal. Programs and data can be stored in the 1GB memory embedded in this FPGA module. To store and transfer data, there are 407600 registers that are used. Adapted for storing data, the DDR3 memory avoids resource conflicts.

XC7K325T-3FFG676E Features


400 I/Os
Up to 16404480 RAM bits
407600 registers

XC7K325T-3FFG676E Applications


There are a lot of Xilinx Inc. XC7K325T-3FFG676E FPGAs applications.

  • DO-254
  • Secure Communication
  • Development Boards and Shields for Microcontrollers
  • Cryptography
  • Data center hardware accelerators
  • Solar Energy
  • Random logic
  • Voice recognition
  • Electronic Warfare
  • Defense Applications

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