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XC7Z030-3SBG485E

XC7Z030-3SBG485E

XC7Z030-3SBG485E

Xilinx Inc.

485 Terminations 0°C~100°C TJ 485 Pin System On Chip Zynq®-7000 Series 130 I/O 1V

SOT-23

XC7Z030-3SBG485E Datasheet

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Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 484-FBGA, FCBGA
Number of Pins 485
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Zynq®-7000
Published 2009
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 485
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Additional Feature PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 0.8mm
Frequency 1GHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.05V
Power Supplies 11.8V
Supply Voltage-Min (Vsup) 0.95V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
UV Erasable N
Length 19mm
Height Seated (Max) 2.44mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $382.20000 $382.2
XC7Z030-3SBG485E Product Details

This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


A core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 484-FBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq®-7000 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~100°C TJ.This SoC security combines Kintex™-7 FPGA, 125K Logic Cells, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.130 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1V.The SoCs wireless cannot operate at a voltage greater than 1.05V because it is considered unsafe for the application.If it has at least a 0.95V volt power supply, it can work fine.In total, there are 485 terminations, so system on a chip is really aided by this.As far as power supplies are concerned, system on chip requires 11.8V.MICROPROCESSOR CIRCUIT is its uPs/uCs/peripheral IC and is used in all of its peripheral SoC meanings.A frequency of 1GHz is used by the wireless SoC to operate.In order to operate the SoC meaning, it must be based on the core architecture of ARM.Moreover, this SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY as its additional features.The computer SoC is available in 485-pin form.

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY


There are a lot of Xilinx Inc.


XC7Z030-3SBG485E System On Chip (SoC) applications.


  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness

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