This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).

A core processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is used to build this SoC.Its package is 676-BBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq®-7000 series.For this SoC meaning, the average operating temperature should be 0°C~85°C TJ.A key point to note is that this SoC security combines Kintex™-7 FPGA, 275K Logic Cells.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 130.A 1V power supply should be used.There are voltages higher than 1.05V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 0.95V.Having 676 terminations in total makes system on a chip possible.667MHz is the wireless SoC's frequency.Based on the core architecture of ARM, the SoC meaning has a high level of performance.The SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY, which are additional features.

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.

256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.

XC7Z035-1FFG676C System On Chip (SoC) applications.

• Vending machines
• POS Terminals
• Measurement tools
• Measurement testers
• Networked sensors
• Robotics
• Central alarm system
• Smart appliances
• Industrial automation devices
• Sports