This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).

Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC is built.Package 676-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series Zynq®-7000.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.It is important to note that this SoC security combines Kintex™-7 FPGA, 275K Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.130 I/Os are included in this SoC part.A 1V power supply is recommended.In total, there are 676 terminations, which makes system on a chip possible.wireless SoCs operate at 800MHz.Core architecture of ARM underpins the SoC meaning.Supply voltage is rated at 1.05V.A minimum of 950mV power is supplied to it.

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.

256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.

XC7Z035-3FBG676E System On Chip (SoC) applications.

• Body control module
• Industrial transport
• Industrial robot
• High-end PLC
• Vending machines
• POS Terminals
• Measurement tools
• Measurement testers
• Networked sensors
• Robotics