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XC7Z035-L2FFG676I

XC7Z035-L2FFG676I

XC7Z035-L2FFG676I

Xilinx Inc.

676 Terminations -40°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V

SOT-23

XC7Z035-L2FFG676I Datasheet

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Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Package / Case 676-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Zynq®-7000
Published 2010
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 676
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B676
Supply Voltage-Max (Vsup) 1.05V
Supply Voltage-Min (Vsup) 0.95V
Number of I/O 130
Speed 800MHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Clock Frequency 800MHz
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Boundary Scan YES
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Length 27mm
Height Seated (Max) 3.37mm
Width 27mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $1,867.14000 $1
XC7Z035-L2FFG676I Product Details

This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


A core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 676-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq®-7000 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.This SoC security combines Kintex™-7 FPGA, 275K Logic Cells, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.130 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1V.The SoCs wireless cannot operate at a voltage greater than 1.05V because it is considered unsafe for the application.If it has at least a 0.95V volt power supply, it can work fine.In total, there are 676 terminations, so system on a chip is really aided by this.Moreover, this SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY as its additional features.It operates at a clock frequency of 800MHz.

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
Clock Frequency: 800MHz


There are a lot of Xilinx Inc.


XC7Z035-L2FFG676I System On Chip (SoC) applications.


  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness

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