CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Data Bus Width
32b
Core Architecture
ARM
Boundary Scan
YES
Speed Grade
-1
RAM (words)
256000
Primary Attributes
Kintex™-7 FPGA, 444K Logic Cells
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
Length
35mm
Height Seated (Max)
3.1mm
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$2,788.41000
$2
XC7Z100-1FFG1156I Product Details
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 1156-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq®-7000 series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Kintex™-7 FPGA, 444K Logic Cells.Housed in the state-of-art Tray package.250 I/Os in total are included in this SoC part.It is advised to utilize a 1V power supply.For the SoCs wireless, a voltage higher than 1.05V is considered unsafe.It can feed on a power supply of at least 0.95V.The wireless SoC works at a frequency of 667MHz.The SoC meaning is based on the core architecture of ARM.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM. Built on MCU, FPGA. Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z100-1FFG1156I System On Chip (SoC) applications.