This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s) are used in the construction of this SoC.Manufacturer assigns package 676-BBGA, FCBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq®-7000 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Kintex™-7 FPGA, 350K Logic Cells is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 130 I/Os.Use a power supply with a voltage of 1V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.05V.A system on a chip benefits from having 676 terminations.Searching XC7Z045 will bring up system on chips with similar specs and purposes.At 667MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.

256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.

XC7Z045-1FBG676I System On Chip (SoC) applications.

• Industrial robot
• High-end PLC
• Vending machines
• POS Terminals
• Measurement tools
• Measurement testers
• Networked sensors
• Robotics
• Central alarm system
• Smart appliances