3.71mm mm FPGAs Kintex? UltraScale? Series 1760-BBGA, FCBGA 1mm mm
SOT-23
XCKU085-1FLVB1760I Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
10 Weeks
Mounting Type
Surface Mount
Package / Case
1760-BBGA, FCBGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Bulk
Published
2012
Series
Kintex® UltraScale™
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
ECCN Code
3A001.A.7.B
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Packing Method
TRAY
Technology
CMOS
Voltage - Supply
0.922V~0.979V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
0.95V
Terminal Pitch
1mm
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
S-PBGA-B1760
Number of Outputs
676
Qualification Status
Not Qualified
Power Supplies
0.95V
Number of I/O
676
Number of Inputs
676
Organization
4100 CLBS
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
1088325
Total RAM Bits
58265600
Number of LABs/CLBs
62190
Number of CLBs
4100
Height Seated (Max)
3.71mm
Length
42.5mm
Width
42.5mm
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCKU085-1FLVB1760I Product Details
XCKU085-1FLVB1760I Overview
In the 1760-BBGA, FCBGA package, you will find fpga chips. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. The I/Os are designed to facilitate a more coherent transfer of data. Logic blocks consist of 1088325 logic elements/cells. It is powered from a supply voltage of 0.95V. In this case, the FPGA part belongs to the Field Programmable Gate Arrays family. FPGA modules can be attached to development boards using a Surface Mount-connector. There is a 0.922V~0.979V-volt supply voltage required for the device to operate. An FPGA belonging to the Kintex? UltraScale? series is referred to as an FPGA. While operating, the operating temperature should be kept within a range of -40°C~100°C TJ. A total of 676 outputs are incorporated into this device. This FPGA model is contained in Bulk for space saving. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 58265600 bFpga chipss. 62190 LABs/CLBs are configured on this FPGA. This is a battery operated device that operates on 0.95V. In its architecture, there are 4100 CLB modules. Due to most industry design purposes, fpga circuit adapts the packing method TRAY.
XCKU085-1FLVB1760I Features
676 I/Os Up to 58265600 RAM bits
XCKU085-1FLVB1760I Applications
There are a lot of Xilinx Inc. XCKU085-1FLVB1760I FPGAs applications.