XCVU35P-3FSVH2104E Overview

There are two packages that contain fpga chips: 2104-BBGA, FCBGA package and X package. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. Having 416 I/Os makes data transfers more coherent. A fundamental building block consists of 1906800 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. Powered by a 0.873V~0.927V supply voltage, fpga chips is able to operate at high speeds. An FPGA belonging to the Virtex? UltraScale+? series is referred to as an FPGA. The operating temperature should be kept at 0°C~100°C TJ when operating. This device is equipped with 49597645 RAM bits in terms of its RAM si49597645e. 108960 LABs/CLBs are configured on this FPGA.

XCVU35P-3FSVH2104E Features

416 I/Os
Up to 49597645 RAM bits

XCVU35P-3FSVH2104E Applications

There are a lot of Xilinx Inc. XCVU35P-3FSVH2104E FPGAs applications.

• Integrating multiple SPLDs
• Scientific Instruments
• Software-defined radios
• Cryptography
• Artificial intelligence (AI)
• Computer hardware emulation
• Wired Communications
• Medical Applications
• Wireless Communications
• Radar and Sensors