FPGAs Kintex? UltraScale+? Series 1517-BBGA, FCBGA
SOT-23
XCKU11P-L1FFVE1517I Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Mounting Type
Surface Mount
Package / Case
1517-BBGA, FCBGA
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
Kintex® UltraScale+™
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.39.00.01
Voltage - Supply
0.698V~0.876V
Number of I/O
512
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
653100
Total RAM Bits
53964800
Number of LABs/CLBs
37320
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCKU11P-L1FFVE1517I Product Details
XCKU11P-L1FFVE1517I Overview
Fpga chips is supplied in the 1517-BBGA, FCBGA package. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. A total of 512 I/Os allow data to be transferred in a more coherent manner. There are 653100 logic elements/cells to form a fundamental building block. An FPGA module can be attached to a development board with a Surface Mount-pin. Fpga chips operates wFpga chipsh a supply voltage of 0.698V~0.876V. It is a type of FPGA belonging to the Kintex? UltraScale+? seies. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. Using the Tray layout, this FPGA model can be contained in a very small amount of space. The RAM bits that are offered by this fpga chips are 53964800. 37320 LABs/CLBs are configured on this FPGA.
XCKU11P-L1FFVE1517I Features
512 I/Os Up to 53964800 RAM bits
XCKU11P-L1FFVE1517I Applications
There are a lot of Xilinx Inc. XCKU11P-L1FFVE1517I FPGAs applications.