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XCKU13P-2FFVE900I

XCKU13P-2FFVE900I

XCKU13P-2FFVE900I

Xilinx Inc.

FPGAs Kintex? UltraScale+? Series 900-BBGA, FCBGA

SOT-23

XCKU13P-2FFVE900I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 900-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Kintex® UltraScale+™
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.39.00.01
Voltage - Supply 0.825V~0.876V
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 304
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 746550
Total RAM Bits 70656000
Number of LABs/CLBs 42660
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
XCKU13P-2FFVE900I Product Details

XCKU13P-2FFVE900I Overview


The package that contains this software is called 900-BBGA, FCBGA. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. Its 304 I/Os help it transfer data more efficiently. A fundamental building block consists of 746550 logic elements/cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. Fpga chips operates wFpga chipsh a supply voltage of 0.825V~0.876V. This is a type of FPGA that is part of the Kintex? UltraScale+? series of FPGAs. When operating the machine, it is important to keep the temperature within -40°C~100°C TJ range. As a result of space limitations, this FPGA model has been included in Tray. This device has 70656000 RAM bits, which is the number of RAM bits that this device offers. The FPGA consists of 42660 LABs/CLBs.

XCKU13P-2FFVE900I Features


304 I/Os
Up to 70656000 RAM bits

XCKU13P-2FFVE900I Applications


There are a lot of Xilinx Inc. XCKU13P-2FFVE900I FPGAs applications.

  • Military Temperature
  • Image processing
  • Wireless Communications
  • Defense Applications
  • Software-defined radio
  • Video & Image Processing
  • Embedded Vision
  • ASIC prototyping
  • Bioinformatics
  • Automotive Applications

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