FPGAs Kintex? UltraScale+? Series 1760-BBGA, FCBGA
SOT-23
XCKU15P-2FFVE1760I Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Mounting Type
Surface Mount
Package / Case
1760-BBGA, FCBGA
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
Kintex® UltraScale+™
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.39.00.01
Voltage - Supply
0.825V~0.876V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
668
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
1143450
Total RAM Bits
82329600
Number of LABs/CLBs
65340
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCKU15P-2FFVE1760I Product Details
XCKU15P-2FFVE1760I Overview
A 1760-BBGA, FCBGA package is provided with this component. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. Fpga chips is programmed wFpga chipsh 668 I/Os for transferring data in a more coherent manner. The basic building blocks of logic contain 1143450 logic elements/cells. With a Surface Mount connector, this FPGA module can be attached to the development board. In order to operate it, it requires a voltage supply of 0.825V~0.876V . As part of the Kintex? UltraScale+? series of FPGAs, it is a type of FPGA. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. In order to save space, this FPGA model has been contained in Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 82329600 bFpga chipss. The FPGA is built as an array of 65340 latches or CLBs.
XCKU15P-2FFVE1760I Features
668 I/Os Up to 82329600 RAM bits
XCKU15P-2FFVE1760I Applications
There are a lot of Xilinx Inc. XCKU15P-2FFVE1760I FPGAs applications.