XCKU15P-3FFVA1156E Overview

In the 1156-BBGA, FCBGA package, you will find fpga chips. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Its 516 I/Os help it transfer data more efficiently. A fundamental building block is made up of 1143450 logic elements/cells. The Surface Mount-slot connector on the FPGA module can be connected to the development board. In order for it to operate, the supply voltage must be 0.873V~0.927V . FPGAs belonging to the Kintex? UltraScale+? series are a type of FPGA that belong to the Kintex? UltraScale+? series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~100°C TJ when the device is operating. In order to save space, this FPGA model has been contained in Tray. As far as the RAM bits are concerned, this device offers you a total of 82329600. The FPGA consists of 65340 LABs/CLBs.

XCKU15P-3FFVA1156E Features

516 I/Os
Up to 82329600 RAM bits

XCKU15P-3FFVA1156E Applications

There are a lot of Xilinx Inc. XCKU15P-3FFVA1156E FPGAs applications.

• High Performance Computing
• Enterprise networking
• Data Center
• Image processing
• OpenCL
• Ecosystem
• Bioinformatics
• Digital signal processing
• ADAS
• Embedded Vision