XCKU15P-L2FFVE1517E Overview

In the 1517-BBGA, FCBGA package, you will find fpga chips. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 512 I/Os are programmed to ensure a more coherent data transfer. Logic elements/cells form the fundamental building block of a computer. With a Surface Mount connector, this FPGA module can be attached to the development board. There is a 0.698V~0.876V-volt supply voltage required for the device to operate. The FPGA belongs to the Kintex? UltraScale+? series of FPGAs, and it is one type of FPGA. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~100°C TJ while the machine is operating. As a space-saving measure, this FPGA model is contained within Tray. Fpga electronics is worth mentioning that this device provides 82329600 bfpga electronics s of RAM. A total of 65340 LABs/CLBs make up this FPGA array.

XCKU15P-L2FFVE1517E Features

512 I/Os
Up to 82329600 RAM bits

XCKU15P-L2FFVE1517E Applications

There are a lot of Xilinx Inc. XCKU15P-L2FFVE1517E FPGAs applications.

• Enterprise networking
• Voice recognition
• OpenCL
• Aerospace and Defense
• Embedded Vision
• Medical Electronics
• Camera time adjustments
• ADAS
• Digital signal processing
• Wired Communications