XCKU3P-1SFVB784I Overview

A 784-BBGA, FCBGA package is provided with this component. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. A total of 256 I/Os allow data to be transferred in a more coherent manner. A fundamental building block consists of 355950 logic elements/cells. An electrical supply voltage of 0.85V powers it. This FPGA module can be attached to the development board with a Surface Mount. With a supply voltage of 0.825V~0.876V, this device operates with ease. An FPGA belonging to the Kintex? UltraScale+? series is referred to as an FPGA. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -40°C~100°C TJ when operating the machine. As a space-saving measure, this FPGA model is contained within Tray. In total, it has 784 terminations on each end. This device is equipped with 31641600 RAM bits in terms of its RAM si31641600e. This FPGA is built as an array of 20340 LABs/CLBs.

XCKU3P-1SFVB784I Features

256 I/Os
Up to 31641600 RAM bits

XCKU3P-1SFVB784I Applications

There are a lot of Xilinx Inc. XCKU3P-1SFVB784I FPGAs applications.

• Defense Applications
• Development Boards and Shields for Microcontrollers
• Automation
• Data Mining
• Medical Electronics
• Wired Communications
• Automotive driver's assistance
• Video & Image Processing
• Aerospace and Defense
• Audio