XCKU3P-3SFVB784E Overview

This package is included in the 784-BBGA, FCBGA package and is available for purchase. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. A total of 304 I/Os allow data to be transferred in a more coherent manner. A fundamental building block consists of 355950 logic elements/cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. This device is powered by a 0.873V~0.927V battery. There are many types of FPGAs in the Kintex? UltraScale+? series, this is one of them. During the operation of the system, the operating temperature should remain within the range of 0°C~100°C TJ. In order to save space, this FPGA model has been contained in Tray. This device has 31641600 RAM bits, which is the number of RAM bits that this device offers. The FPGA is built as an array of 20340 latches or CLBs.

XCKU3P-3SFVB784E Features

304 I/Os
Up to 31641600 RAM bits

XCKU3P-3SFVB784E Applications

There are a lot of Xilinx Inc. XCKU3P-3SFVB784E FPGAs applications.

• Data Mining
• Automotive advanced driver assistance systems (ADAS)
• Data center hardware accelerators
• Audio
• Military Temperature
• ASIC prototyping
• Embedded Vision
• Automotive driver's assistance
• ADAS
• Filtering and communication encoding