XCKU5P-2FFVA676E Overview

There are two packages that contain fpga chips: 676-BBGA, FCBGA package and X package. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. This device features 256 I/Os in order to transfer data in a more efficient manner. Logic elements/cells form the fundamental building block of a computer. FPGA modules can be attached to development boards using a Surface Mount-connector. There is a 0.825V~0.876V-volt supply voltage required for the device to operate. It is a type of FPGA belonging to the Kintex? UltraScale+? seies. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~100°C TJ when operating the machine. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. This device is equipped with 41984000 RAM bits in terms of its RAM si41984000e. Fpga electronics contains 27120 LABs/CLBs in an array.

XCKU5P-2FFVA676E Features

256 I/Os
Up to 41984000 RAM bits

XCKU5P-2FFVA676E Applications

There are a lot of Xilinx Inc. XCKU5P-2FFVA676E FPGAs applications.

• Camera time adjustments
• Military DSP
• Secure Communication
• Industrial IoT
• ADAS
• Data center hardware accelerators
• Ecosystem
• Solar Energy
• Digital signal processing
• Space Applications