XCKU5P-1FFVA676E Overview

Fpga chips is supplied in the 676-BBGA, FCBGA package. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. This device features 256 I/Os in order to transfer data in a more efficient manner. There are 474600 logic elements/cells to form a fundamental building block. FPGA modules can be attached to development boards using a Surface Mount-connector. In order to operate it, it requires a voltage supply of 0.825V~0.876V . It is a type of FPGA that belongs to the Kintex? UltraScale+? series of FPGAs. As far as the operating temperature is concerned, it should be kept within 0°C~100°C TJ when operating. It is for space saving reasons that this FPGA model is contained in Tray. The RAM bits that are offered by this fpga chips are 41984000. 27120 LABs/CLBs are integrated into this FPGA.

XCKU5P-1FFVA676E Features

256 I/Os
Up to 41984000 RAM bits

XCKU5P-1FFVA676E Applications

There are a lot of Xilinx Inc. XCKU5P-1FFVA676E FPGAs applications.

• DO-254
• High Performance Computing
• Consumer Electronics
• Solar Energy
• Data center hardware accelerators
• Military DSP
• Wireless Communications
• Broadcast
• Medical imaging
• Data Center