XCKU5P-3FFVB676E Overview

A 676-BBGA, FCBGA package is provided with this component. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. A total of 280 I/Os allow data to be transferred in a more coherent manner. In order to construct a fundamental building block, 474600 logic elements/cells are required. The Surface Mount-slot on the development board allows you to attach the FPGA module. A supply voltage of 0.825V~0.876V is needed in order for fpga chips to operate. An FPGA belonging to the Kintex? UltraScale+? series is referred to as an FPGA. While operating, the operating temperature should be kept within a range of 0°C~100°C TJ. A model of this FPGA is contained in Tray for the purpose of saving space. This device is equipped with 41984000 RAM bits in terms of its RAM si41984000e. Fpga electronics contains 27120 LABs/CLBs in an array.

XCKU5P-3FFVB676E Features

280 I/Os
Up to 41984000 RAM bits

XCKU5P-3FFVB676E Applications

There are a lot of Xilinx Inc. XCKU5P-3FFVB676E FPGAs applications.

• Device controllers
• Military DSP
• Defense Applications
• Telecommunication
• Military Temperature
• Industrial,Medical and Scientific Instruments
• Automotive Applications
• Consumer Electronics
• Automotive
• Filtering and communication encoding