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XCKU5P-L2FFVA676E

XCKU5P-L2FFVA676E

XCKU5P-L2FFVA676E

Xilinx Inc.

FPGAs Kintex? UltraScale+? Series 676-BBGA, FCBGA

SOT-23

XCKU5P-L2FFVA676E Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 676-BBGA, FCBGA
Operating Temperature 0°C~110°C TJ
Packaging Tray
Series Kintex® UltraScale+™
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.39.00.01
Voltage - Supply 0.698V~0.876V
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 256
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 474600
Total RAM Bits 41984000
Number of LABs/CLBs 27120
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $2,450.16000 $2
XCKU5P-L2FFVA676E Product Details

XCKU5P-L2FFVA676E Overview


A 676-BBGA, FCBGA package contains it, and it is available for download. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. A total of 256 I/Os are programmed to ensure a more coherent data transfer. Logic blocks consist of 474600 logic elements/cells. FPGA modules can be attached to development boards using a Surface Mount-connector. There is a 0.698V~0.876V-volt supply voltage required for the device to operate. It is a type of FPGA that belongs to the Kintex? UltraScale+? series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~110°C TJ when operating the machine. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. A device like this one offers 41984000 RAM bits, which is a considerable amount of memory. The FPGA consists of 27120 LABs/CLBs.

XCKU5P-L2FFVA676E Features


256 I/Os
Up to 41984000 RAM bits

XCKU5P-L2FFVA676E Applications


There are a lot of Xilinx Inc. XCKU5P-L2FFVA676E FPGAs applications.

  • ADAS
  • Consumer Electronics
  • Automation
  • Random logic
  • Ecosystem
  • Software-defined radios
  • Embedded Vision
  • Data center hardware accelerators
  • Medical ultrasounds
  • Scientific Instruments

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