XCKU9P-1FFVE900E Overview

There is a 900-BBGA, FCBGA package that includes this component. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. There are 304 I/Os for better data transfer. A fundamental building block is made up of 599550 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. Fpga chips operates at a voltage of 0.825V~0.876V and uses a battery to supply power. It is a type of FPGA that belongs to the Kintex? UltraScale+? series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~100°C TJ while the machine is operating. Using the Bulk layout, this FPGA model can be contained in a very small amount of space. A device like this one offers 41881600 RAM bits, which is a considerable amount of memory. An array of 34260 LABs/CLBs is built into the FPGA.

XCKU9P-1FFVE900E Features

304 I/Os
Up to 41881600 RAM bits

XCKU9P-1FFVE900E Applications

There are a lot of Xilinx Inc. XCKU9P-1FFVE900E FPGAs applications.

• Radar and Sensors
• Military DSP
• Data Mining
• Automotive advanced driver assistance systems (ADAS)
• Embedded Vision
• Cryptography
• Audio
• Space Applications
• Digital signal processing
• Industrial IoT