XCVU11P-2FLGA2577E Overview

There is a 2577-BBGA, FCBGA package that includes this component. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 448 I/Os for transferring data in a more coherent manner. Logic elements/cells form the fundamental building block of a computer. Surface Mount-connectors can be used to attach this FPGA module to the development board. Fpga chips operates at a voltage of 0.825V~0.876V and uses a battery to supply power. It is a type of FPGA belonging to the Virtex? UltraScale+? seies. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~100°C TJ when the device is operating. As a result of space limitations, this FPGA model has been included in Tray. As far as the RAM bits are concerned, this device offers you a total of 396150400. An array of 162000 LABs/CLBs is built into the FPGA.

XCVU11P-2FLGA2577E Features

448 I/Os
Up to 396150400 RAM bits

XCVU11P-2FLGA2577E Applications

There are a lot of Xilinx Inc. XCVU11P-2FLGA2577E FPGAs applications.

• Random logic
• Automotive Applications
• Military Temperature
• Automotive advanced driver assistance systems (ADAS)
• Software-defined radios
• Development Boards and Shields for Microcontrollers
• Consumer Electronics
• Solar Energy
• Artificial intelligence (AI)
• Video & Image Processing