FPGAs Virtex? UltraScale+? Series 2104-BBGA, FCBGA
SOT-23
XCVU11P-2FSGD2104E Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Mounting Type
Surface Mount
Package / Case
2104-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Series
Virtex® UltraScale+™
JESD-609 Code
e1
Part Status
Active
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code
8542.39.00.01
Voltage - Supply
0.825V~0.876V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reach Compliance Code
not_compliant
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
572
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
2835000
Total RAM Bits
396150400
Number of LABs/CLBs
162000
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCVU11P-2FSGD2104E Product Details
XCVU11P-2FSGD2104E Overview
This package is included in the 2104-BBGA, FCBGA package and is available for purchase. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Its 572 I/Os help it transfer data more efficiently. A fundamental building block consists of 2835000 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. The supply voltage of the device is 0.825V~0.876V , at which it runs. The Virtex? UltraScale+? series FPGA is a type of FPGA that belongs to the Virtex? UltraScale+? family of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~100°C TJ when operating the machine. There is an FPGA model contained in Tray in order to conserve space. The RAM bits that this device offer is 396150400. A total of 162000 LABs/CLBs are included in this FPGA.
XCVU11P-2FSGD2104E Features
572 I/Os Up to 396150400 RAM bits
XCVU11P-2FSGD2104E Applications
There are a lot of Xilinx Inc. XCVU11P-2FSGD2104E FPGAs applications.