M1A3PE3000-2FGG896 Overview

A 896-BGA package is provided with this component. A total of 620 I/Os are programmed to ensure a more coherent data transfer. The Surface Mount-slot connector on the FPGA module can be connected to the development board. In order to operate it, it requires a voltage supply of 1.425V~1.575V . FPGAs belonging to the ProASIC3E series are a type of FPGA that belong to the ProASIC3E series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~85°C TJ when operating the machine. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Fpga electronics is worth mentioning that this device provides 516096 bfpga electronics s of RAM. Its base part number M1A3PE3000 can be used to find parts that are related to it. For the program to work properly, the RAM si63kBe of this FPGA module must reach 63kB GB in order to ensure normal operation. Fpga electronics is designed wfpga electronics h 896 pins. Providing that this FPGA is mounted in Surface Mount, it will be able to perform according to its specifications in a flawless manner. In operation with 1.5V, designers can take advantage of its flexibility to the fullest extent. When this module is operated at its maximum operating temperature, it reaches 70°C. Fpga electronics is recommended that the operating temperature be higher than 0°C. The basic building block of this system consists of 3000000 gates. During the process of storing and transferring data, 75264 registers are used. A maximum voltage of 1.575V can be supplied to it. Using a supply voltage as low as 1.425V, fpga semiconductor will work. This FPGA can get as fast as 310MHz. There is a device package provided by 896-FBGA (31x31) as its supplier.

M1A3PE3000-2FGG896 Features

620 I/Os
Up to 516096 RAM bits
896 LABs/CLBs
70°C gates
75264 registers

M1A3PE3000-2FGG896 Applications

There are a lot of Microsemi Corporation M1A3PE3000-2FGG896 FPGAs applications.

• Software-defined radio
• Digital signal processing
• Data Center
• Server Applications
• Security systems
• ASIC prototyping
• ADAS
• Voice recognition
• Embedded Vision
• Integrating multiple SPLDs