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XCVU11P-L2FLGB2104E

XCVU11P-L2FLGB2104E

XCVU11P-L2FLGB2104E

Xilinx Inc.

FPGAs Virtex? UltraScale+? Series 2104-BBGA, FCBGA

SOT-23

XCVU11P-L2FLGB2104E Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 2104-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2013
Series Virtex® UltraScale+™
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.39.00.01
Voltage - Supply 0.698V~0.876V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code not_compliant
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 572
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 2835000
Total RAM Bits 396150400
Number of LABs/CLBs 162000
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
XCVU11P-L2FLGB2104E Product Details

XCVU11P-L2FLGB2104E Overview


A 2104-BBGA, FCBGA package is provided with this component. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. This device features 572 I/Os in order to transfer data in a more efficient manner. To form a fundamental building block, there are 2835000 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. Fpga chips operates at a voltage of 0.698V~0.876V and uses a battery to supply power. It is a type of FPGA that belongs to the Virtex? UltraScale+? series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~100°C TJ when the device is operating. There is an FPGA model contained in Tray in order to conserve space. A device like this one offers 396150400 RAM bits, which is a considerable amount of memory. 162000 LABs/CLBs are integrated into this FPGA.

XCVU11P-L2FLGB2104E Features


572 I/Os
Up to 396150400 RAM bits

XCVU11P-L2FLGB2104E Applications


There are a lot of Xilinx Inc. XCVU11P-L2FLGB2104E FPGAs applications.

  • Military Temperature
  • Random logic
  • Automotive
  • Computer hardware emulation
  • Broadcast
  • Artificial intelligence (AI)
  • Wireless Communications
  • Industrial Ethernet
  • Medical ultrasounds
  • Automotive driver's assistance

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