FPGAs Virtex? UltraScale+? Series 2104-BBGA, FCBGA
SOT-23
XCVU11P-L2FLGB2104E Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Mounting Type
Surface Mount
Package / Case
2104-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Published
2013
Series
Virtex® UltraScale+™
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.39.00.01
Voltage - Supply
0.698V~0.876V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reach Compliance Code
not_compliant
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
572
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
2835000
Total RAM Bits
396150400
Number of LABs/CLBs
162000
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCVU11P-L2FLGB2104E Product Details
XCVU11P-L2FLGB2104E Overview
A 2104-BBGA, FCBGA package is provided with this component. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. This device features 572 I/Os in order to transfer data in a more efficient manner. To form a fundamental building block, there are 2835000 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. Fpga chips operates at a voltage of 0.698V~0.876V and uses a battery to supply power. It is a type of FPGA that belongs to the Virtex? UltraScale+? series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~100°C TJ when the device is operating. There is an FPGA model contained in Tray in order to conserve space. A device like this one offers 396150400 RAM bits, which is a considerable amount of memory. 162000 LABs/CLBs are integrated into this FPGA.
XCVU11P-L2FLGB2104E Features
572 I/Os Up to 396150400 RAM bits
XCVU11P-L2FLGB2104E Applications
There are a lot of Xilinx Inc. XCVU11P-L2FLGB2104E FPGAs applications.