XCVU125-2FLVB1760E Overview

There are two packages that contain fpga chips: 1760-BBGA, FCBGA package and X package. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. The I/Os are designed to facilitate a more coherent transfer of data. To form a fundamental building block, there are 1566600 logic elements/cells. Power is provided by a 0.95V-volt supply. By attaching the Surface Mount connector, you can use this FPGA module with your development board. In order to operate it, it requires a voltage supply of 0.922V~0.979V . As part of the Virtex? UltraScale? series of FPGAs, it is a type of FPGA. During the operation of the system, the operating temperature should remain within the range of 0°C~100°C TJ. There is an FPGA model contained in Bulk in order to conserve space. Having a RAM bit size of 90726400 means that this device will offer you a lot of memory. This FPGA is built as an array of 89520 LABs/CLBs. In its architecture, there are 1200 CLB modules.

XCVU125-2FLVB1760E Features

702 I/Os
Up to 90726400 RAM bits

XCVU125-2FLVB1760E Applications

There are a lot of Xilinx Inc. XCVU125-2FLVB1760E FPGAs applications.

• Defense Applications
• Radar and Sensors
• ASIC prototyping
• Software-defined radio
• Data center search engines
• Ecosystem
• OpenCL
• Automotive advanced driver assistance systems (ADAS)
• Medical ultrasounds
• High Performance Computing