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XCVU13P-1FLGA2577E

XCVU13P-1FLGA2577E

XCVU13P-1FLGA2577E

Xilinx Inc.

FPGAs Virtex? UltraScale+? Series 2577-BBGA, FCBGA

SOT-23

XCVU13P-1FLGA2577E Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 2577-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Virtex® UltraScale+™
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.39.00.01
Voltage - Supply 0.825V~0.876V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code not_compliant
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 448
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 3780000
Total RAM Bits 514867200
Number of LABs/CLBs 216000
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
XCVU13P-1FLGA2577E Product Details

XCVU13P-1FLGA2577E Overview


The package that contains this software is called 2577-BBGA, FCBGA. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Having 448 I/Os makes data transfers more coherent. In order to construct a fundamental building block, 3780000 logic elements/cells are required. An FPGA module can be attached to a development board with a Surface Mount-pin. The supply voltage of the device is 0.825V~0.876V , at which it runs. The Virtex? UltraScale+? Series is one of the types of FPGAs that belong to this type. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~100°C TJ while the machine is operating. This FPGA model is contained in Tray for space saving. A device like this one offers 514867200 RAM bits, which is a considerable amount of memory. An array of 216000 LABs/CLBs is built into the FPGA.

XCVU13P-1FLGA2577E Features


448 I/Os
Up to 514867200 RAM bits

XCVU13P-1FLGA2577E Applications


There are a lot of Xilinx Inc. XCVU13P-1FLGA2577E FPGAs applications.

  • Development Boards and Shields for Microcontrollers
  • Wireless Communications
  • Data center search engines
  • Scientific Instruments
  • Consumer Electronics
  • Defense Applications
  • Aerospace and Defense
  • Telecommunication
  • Space Applications
  • Image processing

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