XCVU13P-2FHGC2104E Overview

There are two packages that contain fpga chips: 2104-BBGA, FCBGA package and X package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. 416 I/Os are available for transferring data more efficiently. Logic elements/cells form the fundamental building block of a computer. The Surface Mount-slot connector on the FPGA module can be connected to the development board. The supply voltage of the device is 0.825V~0.876V , at which it runs. As part of the Virtex? UltraScale+? series of FPGAs, it is a type of FPGA. While operating, the operating temperature should be kept within a range of 0°C~100°C TJ. A model of this FPGA is contained in Tray for the purpose of saving space. As far as the RAM bits are concerned, this device offers you a total of 514867200. Fpga electronics contains 216000 LABs/CLBs in an array.

XCVU13P-2FHGC2104E Features

416 I/Os
Up to 514867200 RAM bits

XCVU13P-2FHGC2104E Applications

There are a lot of Xilinx Inc. XCVU13P-2FHGC2104E FPGAs applications.

• Development Boards and Shields for Microcontrollers
• Image processing
• DO-254
• Space Applications
• Aerospace and Defense
• Broadcast
• Defense Applications
• Medical Applications
• Consumer Electronics
• Video & Image Processing