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XCVU13P-2FIGD2104I

XCVU13P-2FIGD2104I

XCVU13P-2FIGD2104I

Xilinx Inc.

FPGAs Virtex? UltraScale+? Series 2104-BBGA, FCBGA

SOT-23

XCVU13P-2FIGD2104I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 2104-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Virtex® UltraScale+™
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.39.00.01
Voltage - Supply 0.825V~0.876V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code not_compliant
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 676
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 3780000
Total RAM Bits 514867200
Number of LABs/CLBs 216000
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
XCVU13P-2FIGD2104I Product Details

XCVU13P-2FIGD2104I Overview


There are two packages that contain fpga chips: 2104-BBGA, FCBGA package and X package. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. 676 I/Os are available for transferring data more efficiently. A fundamental building block contains 3780000 logic elements or cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. In order to operate it, it requires a voltage supply of 0.825V~0.876V . The Virtex? UltraScale+? series FPGA is a type of FPGA that belongs to the Virtex? UltraScale+? family of FPGAs. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. There is an FPGA model contained in Tray in order to conserve space. As far as the RAM bits are concerned, this device offers you a total of 514867200. 216000 LABs and CLBs are built into this FPGA.

XCVU13P-2FIGD2104I Features


676 I/Os
Up to 514867200 RAM bits

XCVU13P-2FIGD2104I Applications


There are a lot of Xilinx Inc. XCVU13P-2FIGD2104I FPGAs applications.

  • Medical Electronics
  • Wireless Communications
  • High Performance Computing
  • Solar Energy
  • Wired Communications
  • Video & Image Processing
  • Electronic Warfare
  • Ecosystem
  • Computer hardware emulation
  • Defense Applications

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