XCVU13P-2FLGA2577E Overview

A 2577-BBGA, FCBGA package is provided with this component. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. A total of 448 I/Os are programmed to ensure a more coherent data transfer. A fundamental building block consists of 3780000 logic elements/cells. This FPGA module can be attached to the development board with a Surface Mount. A supply voltage of 0.825V~0.876V is needed in order for fpga chips to operate. As part of the Virtex? UltraScale+? series of FPGAs, it is a type of FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~100°C TJ when the device is operating. Using the Tray layout, this FPGA model can be contained in a very small amount of space. As far as the RAM bits are concerned, this device offers you a total of 514867200. Fpga electronics is important that this FPGA module has a RAM si11.8MBe of 11.8MB in order to ensure that the program will run normally. A total of 216000 LABs/CLBs make up this FPGA array.

XCVU13P-2FLGA2577E Features

448 I/Os
Up to 514867200 RAM bits

XCVU13P-2FLGA2577E Applications

There are a lot of Xilinx Inc. XCVU13P-2FLGA2577E FPGAs applications.

• High Performance Computing
• Wireless Communications
• Electronic Warfare
• Camera time adjustments
• Server Applications
• Scientific Instruments
• Medical Electronics
• Automotive Applications
• Artificial intelligence (AI)
• Defense Applications