XCVU13P-3FLGA2577E Overview

A 2577-BBGA, FCBGA package contains it, and it is available for download. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. There are 448 I/Os for better data transfer. There are 3780000 logic elements/cells to form a fundamental building block. Surface Mount-connectors can be used to attach this FPGA module to the development board. A supply voltage of 0.873V~0.927V is needed in order for fpga chips to operate. It is a type of FPGA that belongs to the Virtex? UltraScale+? series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~100°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. The RAM bits that are offered by this fpga chips are 514867200. This FPGA is built as an array of 216000 LABs/CLBs.

XCVU13P-3FLGA2577E Features

448 I/Os
Up to 514867200 RAM bits

XCVU13P-3FLGA2577E Applications

There are a lot of Xilinx Inc. XCVU13P-3FLGA2577E FPGAs applications.

• Medical ultrasounds
• Automotive
• Image processing
• Software-defined radio
• Aircraft navigation
• Development Boards and Shields for Microcontrollers
• Automation
• DO-254
• Server Applications
• Audio