FPGAs Virtex? UltraScale+? Series 2104-BBGA, FCBGA
SOT-23
XCVU13P-L2FHGA2104E Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Mounting Type
Surface Mount
Package / Case
2104-BBGA, FCBGA
Operating Temperature
0°C~110°C TJ
Packaging
Tray
Published
2013
Series
Virtex® UltraScale+™
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.39.00.01
Voltage - Supply
0.698V~0.876V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reach Compliance Code
not_compliant
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
832
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
3780000
Total RAM Bits
514867200
Number of LABs/CLBs
216000
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCVU13P-L2FHGA2104E Product Details
XCVU13P-L2FHGA2104E Overview
Fpga chips is supplied in the 2104-BBGA, FCBGA package. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. There are 832 I/Os for better data transfer. Logic blocks consist of 3780000 logic elements/cells. With a Surface Mount connector, this FPGA module can be attached to the development board. In order for it to operate, the supply voltage must be 0.698V~0.876V . The Virtex? UltraScale+? series FPGA is a type of FPGA that belongs to the Virtex? UltraScale+? family of FPGAs. Operating temperatures should be maintained within the 0°C~110°C TJ range at all times when the unit is in use. This FPGA model is contained in Tray for space saving. This device is equipped with 514867200 RAM bits in terms of its RAM si514867200e. Fpga electronics contains 216000 LABs/CLBs in an array.
XCVU13P-L2FHGA2104E Features
832 I/Os Up to 514867200 RAM bits
XCVU13P-L2FHGA2104E Applications
There are a lot of Xilinx Inc. XCVU13P-L2FHGA2104E FPGAs applications.