FPGAs Virtex? UltraScale+? Series 2577-BBGA, FCBGA
SOT-23
XCVU13P-L2FLGA2577E Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Mounting Type
Surface Mount
Package / Case
2577-BBGA, FCBGA
Operating Temperature
0°C~110°C TJ
Packaging
Tray
Published
2013
Series
Virtex® UltraScale+™
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.39.00.01
Voltage - Supply
0.698V~0.876V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reach Compliance Code
not_compliant
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
448
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
3780000
Total RAM Bits
514867200
Number of LABs/CLBs
216000
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCVU13P-L2FLGA2577E Product Details
XCVU13P-L2FLGA2577E Overview
There is a 2577-BBGA, FCBGA package that includes this component. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. This device features 448 I/Os in order to transfer data in a more efficient manner. In order to construct a fundamental building block, 3780000 logic elements/cells are required. FPGA modules can be attached to development boards using a Surface Mount-connector. In order for it to operate, the supply voltage must be 0.698V~0.876V . The FPGA belongs to the Virtex? UltraScale+? series of FPGAs, and it is one type of FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~110°C TJ at all times. It is for space saving reasons that this FPGA model is contained in Tray. There are 514867200 RAM bits that are available with this device. This FPGA is built as an array of 216000 LABs/CLBs.
XCVU13P-L2FLGA2577E Features
448 I/Os Up to 514867200 RAM bits
XCVU13P-L2FLGA2577E Applications
There are a lot of Xilinx Inc. XCVU13P-L2FLGA2577E FPGAs applications.