XCVU27P-1FIGD2104E Overview

In the package 2104-BBGA, FCBGA, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. There are 676 I/Os for better data transfer. There are 2835000 logic elements/cells to form a fundamental building block. An attachment Surface Mount allows the FPGA module to be attached to the development board. This device is powered by a 0.825V~0.876V battery. There are many types of FPGAs in the Virtex? UltraScale+? series, this is one of them. When operating the machine, it is important to keep the temperature within 0°C~100°C TJ range. The RAM bits that are offered by this fpga chips are 74344038. An array of 162000 LABs/CLBs is built into the FPGA.

XCVU27P-1FIGD2104E Features

676 I/Os
Up to 74344038 RAM bits

XCVU27P-1FIGD2104E Applications

There are a lot of Xilinx Inc. XCVU27P-1FIGD2104E FPGAs applications.

• Electronic Warfare
• Device controllers
• Medical Electronics
• ASIC prototyping
• Computer hardware emulation
• Industrial,Medical and Scientific Instruments
• Automotive Applications
• Ecosystem
• Integrating multiple SPLDs
• Space Applications