XCVU27P-3FSGA2577E Overview

A 2577-BBGA, FCBGA package is provided with this component. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Having 448 I/Os makes data transfers more coherent. Logic blocks consist of 2835000 logic elements/cells. This FPGA module can be attached to the development board with a Surface Mount. A supply voltage of 0.825V~0.876V is needed in order for fpga chips to operate. It is a type of FPGA that belongs to the Virtex? UltraScale+? series of FPGAs. When operating the machine, it is important to keep the temperature within 0°C~100°C TJ range. This device has 74344038 RAM bits, which is the number of RAM bits that this device offers. A total of 162000 LABs/CLBs are included in this FPGA.

XCVU27P-3FSGA2577E Features

448 I/Os
Up to 74344038 RAM bits

XCVU27P-3FSGA2577E Applications

There are a lot of Xilinx Inc. XCVU27P-3FSGA2577E FPGAs applications.

• Integrating multiple SPLDs
• Medical Electronics
• Distributed Monetary Systems
• Camera time adjustments
• Development Boards and Shields for Microcontrollers
• Bioinformatics
• Aerospace and Defense
• Industrial,Medical and Scientific Instruments
• Artificial intelligence (AI)
• Wireless Communications