XCVU29P-1FIGD2104I Overview

There are two packages that contain fpga chips: 2104-BBGA, FCBGA package and X package. A total of 676 I/Os allow data to be transferred in a more coherent manner. A fundamental building block is made up of 3780000 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. Fpga chips operates wFpga chipsh a supply voltage of 0.825V~0.876V. This is a type of FPGA that is part of the Virtex? UltraScale+? series of FPGAs. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. This device has 99090432 RAM bits, which is the number of RAM bits that this device offers. 216000 LABs and CLBs are built into this FPGA.

XCVU29P-1FIGD2104I Features

676 I/Os
Up to 99090432 RAM bits

XCVU29P-1FIGD2104I Applications

There are a lot of Xilinx Inc. XCVU29P-1FIGD2104I FPGAs applications.

• Electronic Warfare
• Scientific Instruments
• Space Applications
• Defense Applications
• Audio
• ADAS
• Data center hardware accelerators
• Development Boards and Shields for Microcontrollers
• Automotive Applications
• Ecosystem