XCVU29P-2FSGA2577E Overview

A 2577-BBGA, FCBGA package is provided with this component. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 448 I/Os for transferring data in a more coherent manner. Logic elements/cells form the fundamental building block of a computer. An FPGA module can be attached to a development board with a Surface Mount-pin. Fpga chips operates wFpga chipsh a supply voltage of 0.825V~0.876V. It is a type of FPGA belonging to the Virtex? UltraScale+? seies. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~100°C TJ when operating the machine. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 99090432 bFpga chipss. A total of 216000 LABs/CLBs are included in this FPGA.

XCVU29P-2FSGA2577E Features

448 I/Os
Up to 99090432 RAM bits

XCVU29P-2FSGA2577E Applications

There are a lot of Xilinx Inc. XCVU29P-2FSGA2577E FPGAs applications.

• Data center hardware accelerators
• Wireless Communications
• Solar Energy
• Random logic
• Industrial Ethernet
• Audio
• Embedded Vision
• Aircraft navigation
• Bioinformatics
• Automation