FPGAs Virtex? UltraScale+? Series 2104-BBGA, FCBGA
SOT-23
XCVU35P-1FSVH2104E Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Mounting Type
Surface Mount
Package / Case
2104-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Series
Virtex® UltraScale+™
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code
8542.39.00.01
Voltage - Supply
0.825V~0.876V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
416
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
1906800
Total RAM Bits
49597645
Number of LABs/CLBs
108960
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$39502.68000
$39502.68
500
$39107.6532
$19553826.6
1000
$38712.6264
$38712626.4
1500
$38317.5996
$57476399.4
2000
$37922.5728
$75845145.6
2500
$37527.546
$93818865
XCVU35P-1FSVH2104E Product Details
XCVU35P-1FSVH2104E Overview
Fpga chips is supplied in the 2104-BBGA, FCBGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 416 I/Os for transferring data in a more coherent manner. To form a fundamental building block, there are 1906800 logic elements/cells. Using a Surface Mount connector, you can mount this FPGA module on the development board. There is a 0.825V~0.876V-volt supply voltage required for the device to operate. As part of the Virtex? UltraScale+? series of FPGAs, it is a type of FPGA. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~100°C TJ while the machine is operating. Having a RAM bit size of 49597645 means that this device will offer you a lot of memory. An array of 108960 LABs/CLBs is built into the FPGA.
XCVU35P-1FSVH2104E Features
416 I/Os Up to 49597645 RAM bits
XCVU35P-1FSVH2104E Applications
There are a lot of Xilinx Inc. XCVU35P-1FSVH2104E FPGAs applications.