FPGAs Virtex? UltraScale+? Series 2104-BBGA, FCBGA
SOT-23
XCVU5P-L2FLVB2104E Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
13 Weeks
Mounting Type
Surface Mount
Package / Case
2104-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Published
2013
Series
Virtex® UltraScale+™
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.39.00.01
Voltage - Supply
0.698V~0.876V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
702
RAM Size
4.5MB
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
1313763
Total RAM Bits
190976000
Number of LABs/CLBs
75072
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCVU5P-L2FLVB2104E Product Details
XCVU5P-L2FLVB2104E Overview
In the 2104-BBGA, FCBGA package, you will find fpga chips. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 702 I/Os are programmed to ensure a more coherent data transfer. There are 1313763 logic elements/cells to form a fundamental building block. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Powered by a 0.698V~0.876V supply voltage, fpga chips is able to operate at high speeds. It is a type of FPGA that belongs to the Virtex? UltraScale+? series of FPGAs. During the operation of the system, the operating temperature should remain within the range of 0°C~100°C TJ. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. This device is equipped with 190976000 RAM bits in terms of its RAM si190976000e. This FPGA module has a RAM si4.5MBe of 4.5MB that is sufficient to make sure that the program is able to run normally. 75072 LABs/CLBs are integrated into this FPGA.
XCVU5P-L2FLVB2104E Features
702 I/Os Up to 190976000 RAM bits
XCVU5P-L2FLVB2104E Applications
There are a lot of Xilinx Inc. XCVU5P-L2FLVB2104E FPGAs applications.