XCVU9P-1FLGA2104I Overview

There are two packages that contain fpga chips: 2104-BBGA, FCBGA package and X package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. A total of 832 I/Os are programmed to ensure a more coherent data transfer. A fundamental building block consists of 2586150 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. In order to operate it, it requires a voltage supply of 0.825V~0.876V . The FPGA belongs to the Virtex? UltraScale+? series of FPGAs, and it is one type of FPGA. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 391168000 bFpga chipss. The FPGA consists of 147780 LABs/CLBs.

XCVU9P-1FLGA2104I Features

832 I/Os
Up to 391168000 RAM bits

XCVU9P-1FLGA2104I Applications

There are a lot of Xilinx Inc. XCVU9P-1FLGA2104I FPGAs applications.

• Aircraft navigation
• Broadcast
• Audio
• Ecosystem
• Camera time adjustments
• Wireless Communications
• ADAS
• Integrating multiple SPLDs
• Bioinformatics
• Wired Communications