FPGAs Virtex? UltraScale+? Series 2577-BBGA, FCBGA
SOT-23
XCVU9P-1FLGA2577E Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
13 Weeks
Mounting Type
Surface Mount
Package / Case
2577-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Series
Virtex® UltraScale+™
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.39.00.01
Voltage - Supply
0.825V~0.876V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reach Compliance Code
not_compliant
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
448
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
2586150
Total RAM Bits
391168000
Number of LABs/CLBs
147780
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCVU9P-1FLGA2577E Product Details
XCVU9P-1FLGA2577E Overview
In the package 2577-BBGA, FCBGA, this product is provided. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. Having 448 I/Os makes data transfers more coherent. Logic blocks consist of 2586150 logic elements/cells. Using a Surface Mount connector, you can mount this FPGA module on the development board. This device is powered by a 0.825V~0.876V battery. An FPGA belonging to the Virtex? UltraScale+? series is referred to as an FPGA. The operating temperature should be kept at 0°C~100°C TJ when operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Fpga electronics is worth mentioning that this device provides 391168000 bfpga electronics s of RAM. A total of 147780 LABs/CLBs make up this FPGA array.
XCVU9P-1FLGA2577E Features
448 I/Os Up to 391168000 RAM bits
XCVU9P-1FLGA2577E Applications
There are a lot of Xilinx Inc. XCVU9P-1FLGA2577E FPGAs applications.