XCVU9P-1FLGA2577I Overview

Fpga chips is supplied in the 2577-BBGA, FCBGA package. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. Having 448 I/Os makes data transfers more coherent. The basic building blocks of logic contain 2586150 logic elements/cells. This FPGA module can be attached to the development board with a Surface Mount. With a supply voltage of 0.825V~0.876V, this device operates with ease. It is a type of FPGA belonging to the Virtex? UltraScale+? seies. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. In order to save space, this FPGA model has been contained in Tray. There are 391168000 RAM bits that are available with this device. Fpga electronics contains 147780 LABs/CLBs in an array.

XCVU9P-1FLGA2577I Features

448 I/Os
Up to 391168000 RAM bits

XCVU9P-1FLGA2577I Applications

There are a lot of Xilinx Inc. XCVU9P-1FLGA2577I FPGAs applications.

• Device controllers
• Camera time adjustments
• Embedded Vision
• Defense Applications
• Cryptography
• ASIC prototyping
• Medical Electronics
• Enterprise networking
• DO-254
• Industrial IoT