FPGAs Virtex? UltraScale+? Series 2104-BBGA, FCBGA
SOT-23
XCVU9P-2FSGD2104I Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
13 Weeks
Mounting Type
Surface Mount
Package / Case
2104-BBGA, FCBGA
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
Virtex® UltraScale+™
Part Status
Active
HTS Code
8542.39.00.01
Voltage - Supply
0.825V~0.876V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reach Compliance Code
not_compliant
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
676
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
2586150
Total RAM Bits
391168000
Number of LABs/CLBs
147780
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCVU9P-2FSGD2104I Product Details
XCVU9P-2FSGD2104I Overview
A 2104-BBGA, FCBGA package contains it, and it is available for download. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. The I/Os are designed to facilitate a more coherent transfer of data. To form a fundamental building block, there are 2586150 logic elements/cells. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Powered by a 0.825V~0.876V supply voltage, fpga chips is able to operate at high speeds. There are many types of FPGAs in the Virtex? UltraScale+? series, this is one of them. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. Using the Tray layout, this FPGA model can be contained in a very small amount of space. The RAM bits that are offered by this fpga chips are 391168000. A total of 147780 LABs/CLBs make up this FPGA array.
XCVU9P-2FSGD2104I Features
676 I/Os Up to 391168000 RAM bits
XCVU9P-2FSGD2104I Applications
There are a lot of Xilinx Inc. XCVU9P-2FSGD2104I FPGAs applications.