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LCMXO3LF-9400E-6BG400C

LCMXO3LF-9400E-6BG400C

LCMXO3LF-9400E-6BG400C

Lattice Semiconductor Corporation

FPGAs MachXO3 Series 400-LFBGA

SOT-23

LCMXO3LF-9400E-6BG400C Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 400-LFBGA
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MachXO3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.14V~1.26V
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 335
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 9400
Total RAM Bits 442368
Number of LABs/CLBs 1175
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
90 $15.85711 $1427.1399
LCMXO3LF-9400E-6BG400C Product Details

LCMXO3LF-9400E-6BG400C Overview


This package is included in the 400-LFBGA package and is available for purchase. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. Its 335 I/Os help it transfer data more efficiently. In order to construct a fundamental building block, 9400 logic elements/cells are required. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates at a voltage of 1.14V~1.26V and uses a battery to supply power. As part of the MachXO3 series of FPGAs, it is a type of FPGA. While operating, the operating temperature should be kept within a range of 0°C~85°C TJ. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Fpga electronics is worth mentioning that this device provides 442368 bfpga electronics s of RAM. An array of 1175 LABs/CLBs is built into the FPGA.

LCMXO3LF-9400E-6BG400C Features


335 I/Os
Up to 442368 RAM bits

LCMXO3LF-9400E-6BG400C Applications


There are a lot of Lattice Semiconductor Corporation LCMXO3LF-9400E-6BG400C FPGAs applications.

  • OpenCL
  • Bioinformatics
  • Medical ultrasounds
  • Wired Communications
  • ADAS
  • Development Boards and Shields for Microcontrollers
  • Embedded Vision
  • Data center hardware accelerators
  • Defense Applications
  • Image processing

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